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Scholarship

Nonresident / International Merit Scholarships

Boise State University

United States

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1 ш

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ScholarshipCloses in 72 days

Boise State University

Application deadlineDec 15, 2026

Opportunity details

The important facts at a glance

Study levelUndergraduate
Funding coverageOther support
Award value or coverage detailsInternational undergraduate applicants may receive merit scholarships ranging from US$5,000 to US$17,000 per year through combinations of the Ridgeline, Summit and Global Scholarships. Ridgeline provides US$5,000 per year and Summit provides US$10,000 per year; eligible first-year awards may continue for up to four years or eight semesters subject to renewal requirements.

Who can apply

Review the official criteria before applying

International first-year undergraduate applicants; Ugandan A-level graduates may apply subject to university and programme entry requirements.

About this opportunity

Program overview and application information

Nonresident / International Merit Scholarships for international students seeking undergraduate study at Boise State University.

Benefits
International undergraduate applicants may receive merit scholarships ranging from US$5,000 to US$17,000 per year through combinations of the Ridgeline, Summit and Global Scholarships. Ridgeline provides US$5,000 per year and Summit provides US$10,000 per year; eligible first-year awards may continue for up to four years or eight semesters subject to renewal requirements.

Requirements
Strong secondary/A-level results; meet programme-specific academic and English-language requirements; additional scholarship materials may be required.

How to apply
Submit the Boise State international undergraduate admission application and all required admission materials by December 15, 2026 for Fall 2027. No separate application is required for the automatic merit scholarships; eligible international applicants are automatically considered.
Ready to continue?Always confirm final requirements and dates on the official website.
Visit official application page
Source checked Sep 23, 2026